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Polyimide Film (TY6052E)

WiththeapplicationofBi-axialstrechingtechnology,thisbrandpolyimidefilm,thelowthermalcoefficientexpansionpolyimidefilm,ismadefrompolyamicacidresins,whichisobtainedfroma novel formulacomprisedofnewanhyd
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Polyimide Film (TY6052E)
 
 
  With the application of Bi-axial streching technology ,this brand polyimide film, the low thermal coefficient expansion polyimide film ,is made from polyamic acid resins,which is obtained from a  novel  formula comprised of new anhydride monomers as well as a mine monomers , it not only processes  the excellent performance of common polyimide film but also has better dimension stability, higher modulus of elasticity and lower thermal expansion coefficient.
1. Technical Requirements
performace Index

NO.

Index Description

Unit

Index Value

12.5µm

25.0µm

1

Tensile

CD/MD

Mpa

≥200

2

Elongation

CD/MD

%

≥40

3

Tensile modulus

CD/MD

GPa

≥4.0

4

Heate expansion coefficient Longitudinal/Transverse200℃,2h

%

≥0.1

5

Electrical operating Frequency intensity

Average

MV/m

≥200

≥200

6

Heate expansion coefficient 25-200℃

ppm/ ℃

15-25

7

A sexual 100%RH

%

≤2.5

8

Volume resistivity 200℃

Ω cm

≥1.0x1012

9

Relative dielectric Constant,48-62Hz

-

3.0-3.5

10

Dielectric Loss Factor 48-62Hz

-

≤0.002

2. Application
    6052E low thermal coefficient expansion polyimide film has higher dimension stability. Its CTE is very near copper foil which is ideal material for FPC as copper board cover.
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Polyimide Film (TY6052E)

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